USA – 3D Glass Solutions Inc., an Albuquerque, N.M.-based innovator of glass-based three-dimensional passive radio frequency (RF) devices, secured $20m in Series B1 funding.
The round was led by Intel Capital with participation from CerraCap Ventures, Lockheed Martin Ventures and Nagase & Co. Ltd. In conjunction with the funding, Intel Capital’s David Flanagan, Lockheed Martin’s Jeff Cunningham and Nagase’s Yoriyuki Yamashiro joined 3DGS’ board of directors. The company intends to use the funds to purchase high volume manufacturing equipment, expand its manufacturing cleanrooms, increase headcount in its production, internal sales management and engineering teams to support demand from its customers.Led by Mark Popovich, CEO and president, 3D Glass Solutions manufactures a wide variety of glass-based, system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® glass ceramic technology for applications in RF electronics and photonics used in automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT industries. 3DGS glass ceramic-based RF products can be combined with any number of designs or devices to create SiP products. 30/11/2021
